Semiconductor_Wafer_of_Microelectronics_

ACTIF WAFER

LEVEL TESTER

FULLY AUTOMATED WAFER LEVEL TESTER

A new generation that supports multiple-wafer tests with faster scanning and shorter test time, Axis-Tec has developed a Fully Automated Wafer Level Tester with feature-rich capabilities that is mass production ready.

Axis-Tec's standard Automated Wafer Level Tester actif comes with all the built-in features and has high flexibilities that can be integrated with a wide range of optical electrical test instruments or equipment to execute testing applications of O-O (Optical to Optical, E-O (Electrical to Optical) and O-E (Optical to Electrical). The wafer level tester is designed and built with automated passive and active align to enable precise optical peak search and electrical probing positioning.

BENEFITS & FEATURES

  • High Speed Fiber / Fiber Array Alignment

    • <3 seconds for single alignment

    • <1dB insertion loss

  • Precision Handling System

    • Vision alignment in multiple dimensions

    • 6 Axis of freedom probers

  • High Integration Flexibility

    • Integrated to various test equipment

    • Expandable to any communication protocol

  • Low Cost Capital Investments

    • Competitive Price offer Shorter ROIs

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SPECIFICATIONS

MECHANICAL SPECIFICATION


Chuck Transfer Unit
Size: 205 mm (8 inch)
Plating: Nickel
Travel X: 300 mm
Travel Y: 700 mm
Resolution X,Y: 0.05 μm
Repeatability: ≤ 1 μm
Speed: Max 500 mm/s
Travel Z: 20 mm
Resolution: 0.1 μm
Repeatability: ≤ 2 μm
Speed: Max 10 mm/s
Rotary (θ): 360 °
Resolution: ≤ 0.005°
Repeatability: ≤ ±0.01°
Speed: 2°/s
AXIS-A6: 6 Axis motion optical probe module. (XYZθφψ)
Travel (X,Y,Z): 50mm
Resolution: 0.05μm
Repeatability: ≤ 1 μm
Speed: 50mm/s
Rotary (θφψ): ± 4°
Resolution: ≤ 0.002°
Repeatability: ≤ ±0.01°
Speed: 2°/s
AXIS-A3: 3 Axis motion electrical probe module. (XYZ)
Travel (X,Y,Z): 50mm
Resolution: 0.1μm
Repeatability: ≤ 1 μm
Speed: 50mm/s




VISION SPECIFICATION


Camera
Resolution: 12M
Zoom: 12X
FOV Max: 15 x 15 mm
FOV Min: 2 x 2 mm
Travel: 20mm
Height Compensation: ≤ 10 μm




GENERAL SPECIFICATION


Size * (Actif): 1.0m x 1.8 m
Height *: 1.8 m
Weight *: 500 kg
Electrical: 220VAC, 3KW
Air Supply: 500 KPa
Others Double Vibration isolation
Cleanroom Compliant * To Be Confirmed




APPLICATION SOFTWARE


Modular software architecture promotes high flexibility in creating customised production sequence. Supports customer test program plug-ins: LabView, TestStand, C#, Python Auto height compensation Flexible wafer/device mapping creation Supports various test instrument integration AX-PSA: Proprietary on-the-fly peak search algorithm