AX-LS Series Laser Scriber
Engineered to high standards, the Axis Tec AX-LS series of Laser Scribers improve yield by creating much narrower scribe lines than traditional mechanical scribing using conventional blade dicers.
The non contact scribing process works by carving a groove hole while melting/vaporizing the wafer surface layers away using a laser beam at a wavelength that causes the material to absorb it.
The AX-LS series allows manufacturers to cleanly scribe brittle materials with its robust, user friendly platform, allowing for reliable manufacturing at a lower cost.
Silicon Wafer Scribing
Ceramic Panel Grooving/Cutting