Engineered to high standards, the Axis Tec AX-LS series of Laser Scribers improve yield by creating much narrower scribe lines than traditional mechanical scribing using  conventional blade dicers.

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The non contact scribing process works by carving a groove hole while melting/vaporizing the wafer surface layers away using a laser beam at a wavelength that causes the material to absorb it.

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The AX-LS series allows manufacturers to cleanly scribe brittle materials with its robust, user friendly platform, allowing for reliable manufacturing at a lower cost.

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Applications

• Silicon Wafer Scribing

• Ceramic Panel Grooving/Cutting