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Semiconductor_Wafer_of_Microelectronics_

ACTIF WAFER

LEVEL TESTER

FULLY AUTOMATED WAFER LEVEL TESTER

A new generation that supports multiple-wafer tests with faster scanning and shorter test time, Axis-Tec has developed a Fully Automated Wafer Level Tester with feature-rich capabilities that is mass production ready.

Axis-Tec's standard Automated Wafer Level Tester actif comes with all the built-in features and has high flexibilities that can be integrated with a wide range of optical electrical test instruments or equipment to execute testing applications of O-O (Optical to Optical, E-O (Electrical to Optical) and O-E (Optical to Electrical). The wafer level tester is designed and built with automated passive and active align to enable precise optical peak search and electrical probing positioning.

BENEFITS & FEATURES

  • High Speed Fiber / Fiber Array Alignment

    • <3 seconds for single alignment

    • <1dB insertion loss

  • Precision Handling System

    • Vision alignment in multiple dimensions

    • 6 Axis of freedom probers

  • High Integration Flexibility

    • Integrated to various test equipment

    • Expandable to any communication protocol

  • Low Cost Capital Investments

    • Competitive Price offer Shorter ROIs

  • GENERAL SPECIFICATION
    Size * (Actif): 1.0m x 1.8 m Height *: 1.8 m Weight *: 500 kg Electrical: 220VAC, 3KW Air Supply: 500 KPa Others Double Vibration isolation Cleanroom Compliant * To Be Confirmed
  • MECHANICAL SPECIFICATION
    Chuck Transfer Unit Size: 205 mm (8 inch) Plating: Nickel Travel X: 300 mm Travel Y: 700 mm Resolution X,Y: 0.05 μm Repeatability: ≤ 1 μm Speed: Max 500 mm/s Travel Z: 20 mm Resolution: 0.1 μm Repeatability: ≤ 2 μm Speed: Max 10 mm/s Rotary (θ): 360 ° Resolution: ≤ 0.005° Repeatability: ≤ ±0.01° Speed: 2°/s AXIS-A6: 6 Axis motion optical probe module. (XYZθφψ) Travel (X,Y,Z): 50mm Resolution: 0.05μm Repeatability: ≤ 1 μm Speed: 50mm/s Rotary (θφψ): ± 4° Resolution: ≤ 0.002° Repeatability: ≤ ±0.01° Speed: 2°/s AXIS-A3: 3 Axis motion electrical probe module. (XYZ) Travel (X,Y,Z): 50mm Resolution: 0.1μm Repeatability: ≤ 1 μm Speed: 50mm/s
  • VISION SPECIFICATION
    Camera Resolution: 12M Zoom: 12X FOV Max: 15 x 15 mm FOV Min: 2 x 2 mm Travel: 20mm Height Compensation: ≤ 10 μm
  • APPLICATION SOFTWARE
    Modular software architecture promotes high flexibility in creating customised production sequence. Supports customer test program plug-ins: LabView, TestStand, C#, Python Auto height compensation Flexible wafer/device mapping creation Supports various test instrument integration AX-PSA: Proprietary on-the-fly peak search algorithm
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