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Semiconductor_Wafer_of_Microelectronics_

ACTIF 晶圆测试系统

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全自动晶圆测试系统

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Axis-Tec公司新一代全自动晶圆级测试仪支持多PLE晶圆测试，测试功能丰富、可批量生产，扫描速度更快、测试时间更短。

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Axis-Tec actif自动晶圆级测试仪具备所有内置功能，并具有高度灵活性，可与各种光电测试仪器或设备集成，以执行O-O（光到光）、E-O（电到光）和O-E（光到电）的测试。晶圆测试仪具备自动被动和主动对准功能，以实现精确的光学峰值搜索和电子探针定位。

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功能特点

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  • 高速光纤/光纤阵列耦合

    • 单次耦合时间<3秒

    • 插入损耗<1dB

  • 精密上下料系统

    • 多维度视频耦合

    • 6轴高精度探针

  • 高灵活度集成

    • 支持各种主流光学和电学测试设备

    • 支持各种主流通信协议

  • 低成本投资

    • 投资回报周期短，投资回报率高，极具竞争性的价格

  • GENERAL SPECIFICATION
    Size * (Actif): 1.0m x 1.8 m Height *: 1.8 m Weight *: 500 kg Electrical: 220VAC, 3KW Air Supply: 500 KPa Others Double Vibration isolation Cleanroom Compliant * To Be Confirmed
  • MECHANICAL SPECIFICATION
    Chuck Transfer Unit Size: 205 mm (8 inch) Plating: Nickel Travel X: 300 mm Travel Y: 700 mm Resolution X,Y: 0.05 μm Repeatability: ≤ 1 μm Speed: Max 500 mm/s Travel Z: 20 mm Resolution: 0.1 μm Repeatability: ≤ 2 μm Speed: Max 10 mm/s Rotary (θ): 360 ° Resolution: ≤ 0.005° Repeatability: ≤ ±0.01° Speed: 2°/s AXIS-A6: 6 Axis motion optical probe module. (XYZθφψ) Travel (X,Y,Z): 50mm Resolution: 0.05μm Repeatability: ≤ 1 μm Speed: 50mm/s Rotary (θφψ): ± 4° Resolution: ≤ 0.002° Repeatability: ≤ ±0.01° Speed: 2°/s AXIS-A3: 3 Axis motion electrical probe module. (XYZ) Travel (X,Y,Z): 50mm Resolution: 0.1μm Repeatability: ≤ 1 μm Speed: 50mm/s
  • VISION SPECIFICATION
    Camera Resolution: 12M Zoom: 12X FOV Max: 15 x 15 mm FOV Min: 2 x 2 mm Travel: 20mm Height Compensation: ≤ 10 μm
  • APPLICATION SOFTWARE
    Modular software architecture promotes high flexibility in creating customised production sequence. Supports customer test program plug-ins: LabView, TestStand, C#, Python Auto height compensation Flexible wafer/device mapping creation Supports various test instrument integration AX-PSA: Proprietary on-the-fly peak search algorithm
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