top of page
Laser.jpg

OPTICAL ACTIVE ASSEMBLY ALIGNER

​

HIGH SPEED DATA ACQUISITION TRANSCEIVER ACTIVE ASSEMBLY ALIGNER

​

The Axis-Tec Optical Active Assembly Aligner (OAAA) has linear movement of the stages with 1.0 um resolution and zero backlash compensation. It has a Main System Controller integrated with a Precision Remote Controlled Power Supply and Lightwave meter.

​

The OAAA is capable of automatic 365nm UV LED Spot curing with 4 UV output heads, with a max UV Light Intensity of 8,000 mW/cm2.

​

It is also capable of manual UV Dispensing with a Digital Pneumatic controller.

​

BENEFITS & FEATURES

​

  • TOSA/ROSA Active Assembly Aligner

  • High Speed Data Acquisition using hardware electronic internal clocking

  • Recipe-based programming structure

    • Ease of switching models during production mode​

  • BIDI and PAM4 Compatible

  • Unique Peak Search Algorithm (PSA)

    • Improve production output without jeopardizing work quality​

  • DUT Fixture Design

    • Plug and play standard equipment​

  • Spare Part Replaceable

    • Ergonomic mechanical design with ease of maintenance in mind​

  • GENERAL SPECIFICATION
    Size * (Actif): 1.0m x 1.8 m Height *: 1.8 m Weight *: 500 kg Electrical: 220VAC, 3KW Air Supply: 500 KPa Others Double Vibration isolation Cleanroom Compliant * To Be Confirmed
  • MECHANICAL SPECIFICATION
    Chuck Transfer Unit Size: 205 mm (8 inch) Plating: Nickel Travel X: 300 mm Travel Y: 700 mm Resolution X,Y: 0.05 μm Repeatability: ≤ 1 μm Speed: Max 500 mm/s Travel Z: 20 mm Resolution: 0.1 μm Repeatability: ≤ 2 μm Speed: Max 10 mm/s Rotary (θ): 360 ° Resolution: ≤ 0.005° Repeatability: ≤ ±0.01° Speed: 2°/s AXIS-A6: 6 Axis motion optical probe module. (XYZθφψ) Travel (X,Y,Z): 50mm Resolution: 0.05μm Repeatability: ≤ 1 μm Speed: 50mm/s Rotary (θφψ): ± 4° Resolution: ≤ 0.002° Repeatability: ≤ ±0.01° Speed: 2°/s AXIS-A3: 3 Axis motion electrical probe module. (XYZ) Travel (X,Y,Z): 50mm Resolution: 0.1μm Repeatability: ≤ 1 μm Speed: 50mm/s
  • VISION SPECIFICATION
    Camera Resolution: 12M Zoom: 12X FOV Max: 15 x 15 mm FOV Min: 2 x 2 mm Travel: 20mm Height Compensation: ≤ 10 μm
  • APPLICATION SOFTWARE
    Modular software architecture promotes high flexibility in creating customised production sequence. Supports customer test program plug-ins: LabView, TestStand, C#, Python Auto height compensation Flexible wafer/device mapping creation Supports various test instrument integration AX-PSA: Proprietary on-the-fly peak search algorithm
bottom of page