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Automatic Silicon Photonics Wafer Level Tester
Automated optical and electrical probing with precision active alignment, wafer mapping and measurement traceability.
View AS Series detailsSingapore · Automated test systems
Silicon photonics test, engineered for production.
Automated optical, electrical and vision test platforms for wafers, laser dies, PICs, MEMS ICs and advanced substrates.
- Wafer · Die · PIC
- Test coverage
- Optical · Electrical · Vision
- Integrated measurements
- R&D → Production
- Scalable architecture
Core platform
Automatic Silicon Photonics Wafer Level Tester
Test sequence
- 01 Locate
- 02 Align
- 03 Measure
- 04 Map
Product portfolio
Six platforms.
One test architecture.
Configure the motion, probing, optics, instrumentation and software around your device—not the other way around.
02Vision
Optical Facet Inspection
Automated imaging and defect review for optical facets, supporting consistent inspection before downstream assembly and test.
View inspection details03Laser
Laser Die Optical Test
Configurable optical and electrical characterization for laser dies, with automated handling, alignment and result binning.
View laser tester details04PIC
PIC Test
Flexible electro-optical test for photonic integrated circuits, from passive structures to active transmit and receive devices.
View PIC tester details05MEMS
MEMS IC Test
TPH environmental sensor, IMU and ambient-light IC test solutions spanning laboratory calibration through automated production.
View MEMS division06Advanced IC
AI Chip IC Substrate Tester
Automatic electrical integrity test for HDI and IC substrates, with precision alignment, high-density switching and production handling.
View substrate testeractif. AS Series
Wafer-scale precision, configured for your test flow.
A fully integrated opto-electrical platform for automatic silicon photonics wafer and chip testing. The AS Series supports R&D characterization, engineering validation and high-volume production within one modular architecture.
Configure an AS system
Standalone or loader-integrated
Optical-access configurations
Three wafer-test paths, one modular platform.
The optical interface, wafer handling and measurement stack are configured around the device architecture and production flow.
Grating Coupler Wafer Level Test
Vertical optical access for surface grating couplers, with vision-guided positioning, fibre-array support, active alignment and wafer-level mapping.
Edge Coupling Wafer Level Test
Precision edge access for polished or prepared facets, using six-axis active alignment with single-fibre or fibre-array interfaces.
Glass-Wafer Photonics Test
Configurable optical and electrical test for glass-based photonic and interposer structures, with handling adapted to the substrate and test plan.
01 / Grating-coupler configuration
Approach the optical interface from above.
Vision-guided positioning brings the fibre interface to each surface grating. The six-axis alignment module then optimizes optical power before the configured measurements and wafer-map sequence run.
- Vertical single-fibre or fibre-array access
- Coarse and fine active optical alignment
- Automatic stepping across the wafer map
02 / Edge-coupling configuration
Reach the prepared edge, then optimize coupling.
Edge access is configured around the wafer, die or interposer geometry. Vision brings the optical interface close to the coupling region before the six-axis module performs the final active power search.
- Prepared or polished facet access
- Single-fibre or fibre-array interface
- Manual setup or recipe-driven alignment
03 / Glass-photonics configuration
Map, illuminate and collect through glass.
A configurable glass-wafer station combines XYR wafer positioning, height mapping, camera guidance and multi-axis optical alignment. The measurement path can be arranged for spot illumination, output collection and spectral analysis.
- Wafer-height mapping and camera registration
- Manual or automated six-axis coupling
- Optical spectrum analysis integration
Where it is used
From the wafer to high-bandwidth systems.
Optical engines, transceiver building blocks and co-packaged optics for high-bandwidth data movement.
Photonic I/O, optical chiplets and interposers designed to move data efficiently between accelerators.
Emitter, receiver and photonic ranging devices for high-channel-count perception and industrial sensing.
01 / Precision motion
Wafer chuck & vision
- Wafer chuck
- 8 / 12 inch
- XY travel
- Up to 350 × 350 mm
- XY resolution
- 0.1 µm
- XY repeatability
- ±1 µm
- Programmable speed
- Up to 70 mm/s
- Microscope zoom
- 0.5× to 5×
02 / Optical alignment
PEAKQUEST 6-axis module
- Active axes
- X, Y, Z, θX, θY, θZ
- XYZ travel
- ±20 mm
- Linear resolution
- 0.05 / 0.02 / 0.01 µm
- Rotational travel
- ±5°
- Coupling
- Edge / vertical grating
- Fiber unit
- Single fiber / fiber array
03 / Electrical probing
Programmable & mechanical probes
- Programmable travel
- ±20 mm XYZ
- Resolution
- 0.1 µm
- Repeatability
- ±0.1 µm
- Probe stations
- Up to 2, north / south
- Electrical test
- Mixed signal, DC and HF
- RF option
- Up to 100G, north station
04 / Open test platform
Software & instrumentation
- Test development
- C# / NI TestStand
- Customer integration
- Python / LabVIEW / C++
- Communications
- GPIB / TCP-IP
- Automation modes
- Manual / semi / full
- Wafer data
- 32-bit binning and map I/O
- Instrument choice
- Flexible brand integration
Opto-electrical coverage
One platform for passive and active PIC test.
Insertion loss, spectral response, wavelength sweep and polarization-dependent loss.
Illuminated DC I-V and S-parameter measurements, including bandwidth and return loss.
S-parameters, wavelength and bias sweeps, insertion loss and optical power sweeps.
DC I-V, C-V and L-V impedance sweeps for complete electrical characterization.
Production automation
Loader-ready by design.
Run the AS Series as a standalone tester or extend it with wafer loading for inline production and reduced manual handling.
- 8 / 12-inch wafer support
- Single-cassette configuration
- Automatic notch alignment
- Wafer ID reader
Specifications are configurable by application. Contact Axis-Tec for the final system configuration and acceptance criteria.
Optical facet inspection
See the surface before it becomes a yield problem.
A configurable vision platform for inspecting fibre-array end faces and laser-die output facets. Defined inspection regions, consistent imaging and recorded pass/fail results help engineers review critical optical surfaces before assembly or optical test.
Configure an inspection system
Inspection optics and acceptance criteria are configured to the device.
01 / Fibre-array facets
Inspect the core—not only the connector.
The core is the most critical optical region. The inspection recipe can separate the core, cladding and coating into defined zones so each area is reviewed against the appropriate acceptance criteria.
- Configurable concentric inspection zones
- Consistent illumination, focus and image capture
- Recorded image with pass/fail disposition
02 / Laser output facets
Review the emitting surface at high magnification.
The system images the output facet around the ridge or emitting aperture and presents detected areas for review. This supports consistent inspection before die attachment, characterization or final assembly.
- 01LocateFind the facet or end face
- 02FocusSet repeatable imaging conditions
- 03InspectApply device-specific zones
- 04RecordSave image and disposition
Defect classes, zone dimensions and pass/fail limits are configured to the customer drawing and agreed inspection standard.
Laser die & COS characterisation
From electrical drive to optical performance—automatically.
An integrated platform for pick-and-place, thermal conditioning, active optical alignment and complete characterisation of chip-on-submount devices. Built around nominal 3 × 5 mm COS, with configurations spanning low-power evaluation to 50 W optical output.
Configure a laser die tester
R&D characterisation · Engineering validation · Automated production
Automated measurement architecture
One recipe coordinates the device, optics and instruments.
The system aligns each COS to the required optical path and records electrical, power, spectral and beam-quality data at programmable operating-current points.
01 / Device handling
Automatic COS pick, place and contact.
The handling module loads a nominal 3 × 5 mm chip-on-submount into an ESD-safe test fixture, establishes the electrical connection and positions the device for repeatable optical measurement.
- Recipe-controlled pick-and-place sequence
- Precision fixture location and electrical probing
- Temperature conditioning at the device plane
- Device identity and result traceability
02 / Active alignment
Route the emission to the measurement that matters.
Programmable motion aligns the COS to an integrating sphere for total optical power, to the sphere’s fibre output and OSA for spectrum, or to a beam profiler for spatial beam analysis.
- Coarse search followed by fine power optimisation
- Integrating sphere and power-meter alignment
- Fibre patch cord from sphere to optical spectrum analyser
- Beam-profiler alignment for X/Y beam quality
- 01LoadPick and place COS
- 02ContactESD-safe electrical interface
- 03ConditionSet device temperature
- 04AlignSphere, OSA or profiler
- 05SweepProgrammable current points
- 06ReportCurves, spectra and beam data
Characterisation & results
Every current point becomes a complete optical record.
At each programmed operating current, the controller coordinates the source, thermal stage and selected instruments. Power and spectrum can be synchronised at the same current set point through the integrating-sphere measurement path.
Optical power, drive current and forward voltage curves, including configurable limits and result binning.
Spectral capture across 800–1700 nm, with the optical path and analyser selected for the device wavelength.
Beam size and divergence on both X and Y axes at selected operating-current conditions.
Automatic report package with plots, test conditions, instrument data, pass/fail status and exportable results.
Protected test environment
Designed for sensitive, high-power emitters.
Performance ranges and measurement instruments are configured to the COS, fixture, optical path and agreed acceptance criteria.
Photonic integrated circuit test
Manual flexibility.
Automated repeatability.
A configurable electro-optical platform for PIC characterization, engineering validation and production development. Operate it manually for process setup or automate device location, active alignment, measurement and result capture through a recipe.
Configure a PIC test system
Optical and electrical instruments are selected for the device and test plan.
01 / PEAKQUEST active alignment
Find and hold the optical peak.
The Axis-Tec six-axis manipulator positions the fibre or fibre array in X, Y, Z and angular axes. PEAKQUEST executes the selected coarse and fine search strategy to optimize coupling at the device.
- Manual jog control for setup and recipe development
- Automated multi-axis power search
- Single-fibre or application-specific optical interface
02 / Vision-guided automation
Move close before active alignment begins.
The optional automatic vision system locates device features or returns to a stored alignment position. The motion system then transfers control to PEAKQUEST for the final optical search and recipe-controlled measurement sequence.
- Device and feature location under the microscope
- Programmed move to pre-set alignment coordinates
- Automatic test execution and result traceability
Integrated test coverage
One station, three electro-optical signal paths.
Optical in · Optical out
Characterize passive optical paths, splitting, insertion loss and wavelength-dependent response.
Optical in · Electrical out
Stimulate photodetector and receiver structures optically while capturing the electrical response.
Electrical in · Optical out
Drive active transmitter, modulator or source structures and measure the resulting optical output.
Wavelength range, electrical bandwidth, probes, fibres and measurement instruments are configured to the PIC and acceptance criteria.
MEMS IC Tester Division
Three sensor domains.
One production path.
Axis-Tec combines controlled stimulus, multi-site contact, precision motion and automated handling for MEMS sensor calibration and functional test.
01 / Environmental sensors
TPH MEMS Sensor Testing
Laboratory and production systems for temperature, pressure and humidity sensor calibration, programmable stimulus and functional test.
- Stimulus
- Temperature · Pressure · Humidity
- Temperature
- −40 to +125 °C
- Extended range
- −55 to +150 °C
- Production scale
- Up to 256 sites
02 / Inertial sensors
MEMS IMU Tester
High-precision calibration and test for accelerometers and gyroscopes, available as laboratory turntables or automation-ready final-test equipment.
- Devices
- Accelerometer · Gyroscope
- Architecture
- Dual rotary tables
- Parallel sites
- 64 × 2
- Rate range
- 10–500 dps
03 / Optical sensors
MEMS ALS IC Tester
Programmable multi-colour illumination for ambient-light and optical sensor calibration, with continuous wavelength and colour-temperature monitoring.
- Light channels
- 7 independent channels
- Illuminance
- 0–3000 lux
- Uniformity
- ≥98% at socket plane
- Monitoring
- Spectrometer feedback
Automatic test & sorting platform
One enclosure, configured around the sensor.
The enclosed MEMS IC tester can be fitted with the required TPH, IMU or ALS stimulus and measurement modules. After the programmed test and calibration sequence, the handler sorts each device into its assigned result bin.
- Automatic device loading and contact
- Sensor-specific stimulus and electrical test
- Post-test pass/fail bin sorting
Representative applications
Sensors inside everyday mobile devices.
Axis-Tec test platforms help sensor manufacturers calibrate and verify the compact devices that enable environmental awareness, adaptive displays and motion intelligence.
Environmental context
Barometric altitude, indoor navigation and temperature–pressure–humidity monitoring in selected handsets and wearables.
Adaptive light response
Automatic display brightness, daylight awareness and power-efficient screen control.
Motion intelligence
Screen rotation, gesture and activity tracking, navigation, fall detection and camera stabilization.
Sensor mix varies by device. IMU and ambient-light sensing are widely used; full TPH sensing is selected according to the product design.
Shared production architecture
From stimulus to sorted device.
- Multi-site testScalable sockets and parallel test channels
- Flexible handlingTray, wafer ring, tape-and-reel, bowl and tube
- Factory integrationAutomated calibration, analysis, reporting and optional AOI
Discuss a MEMS application
Final specifications are configured to the device, stimulus and throughput requirement.
AI chip & advanced packaging
Electrical integrity beneath the chip.
An automatic platform for HDI and IC substrates used in BGA, CSP and advanced-package applications. Precision vision alignment, dense electrical switching and automatic handling bring contact, measurement and traceability into one production system.
Discuss your substrate
Configured to the substrate, fixture and factory flow
Fixture & CAD data compatibility
Move from the substrate design to a repeatable test layout.
Supports standard DD and QD fixtures with a fixture height of 115 ± 2 mm.
Each DUT position on the fixture head can reference its corresponding standard netlist file.
Use the standard grid arrangement, then apply an offset to any individual DUT position when required.
Supports four DUT sets in the standard configuration, subject to the fixture and substrate design.
01 / Electrical coverage
Find interconnect defects.
Open-circuit, short-circuit, four-wire resistance, leakage and spark detection cover the core electrical integrity checks required for high-density substrates.
02 / Production automation
Automate the complete test cycle.
The station coordinates loading, vision alignment, fixture contact, electrical measurement and result handling. Automatic fixture-head cleaning supports repeatable production.
03 / Factory data
Connect results to the line.
Recipe-driven setup, local CSV records, FTP transfer and configurable MES interfaces support traceability from incoming substrate to sorted result.
LoadScan & alignContactMeasureSort & trace
Performance and electrical ranges are configured to the substrate design, fixture and acceptance criteria.
Silicon photonics
From light into data.
Axis-Tec brings precision positioning, optical coupling and device measurement into one automated platform for repeatable PIC and wafer characterization.
01
Find the coupling pointVision-guided device location shortens the path to first light.
02
Optimize optical powerAutomated multi-axis alignment searches, peaks and maintains coupling.
03
Run the test planCoordinate wavelength sweeps, polarization, DC, RF and optical instruments.
04
Turn results into yieldMap every device, retain measurement context and support production decisions.
Closed-loop
Active
alignment
alignment
InputDevice map
ControlMotion + optics
MeasureOptical + electrical
OutputData + binning
Automated workflow
A continuous path from device to decision.
- 01LoadWafer, die, tray or custom carrier
- 02LocateVision registration and feature finding
- 03AlignProbe contact and optical optimization
- 04MeasureSynchronized instrument sequences
- 05ClassifyRules, limits and AI-assisted review
- 06TraceResult mapping and production records
System integration
Built around your measurement stack.
One engineering partner for mechanics, automation, optics, instrumentation and production software.
Electrical test foundation
Axis-Tec aTCA ATE platform.
Our modular ATE test head provides the core electrical functions needed by custom test systems and can be combined with the required device interface and automation.
Precision mechanics
Motion architecture, probing, fixtures, thermal control and automated material handling.
Optics & instrumentation
Flexible integration with different brands of optical instruments, laser sources, detectors, fibre positioning and free-space optical paths.
Software & data
Integrate customer Python scripts, LabVIEW sequences or C++ modules with recipes, instrument control, mapping and traceability.
Start the conversation
Bring us your next test challenge.
Tell us about your device, measurements, throughput and factory interface. We’ll help shape the platform.